Examination of NCSL (near-coincidence site lattice) structures formed during β2 (Ni3-xTe2) precipitation in diffusion-bonded PbTe-Ni interfaces–A TEM study

D Kumar, MP Singh, N Ravishankar, K Chattopadhyay - Acta Materialia, 2024 - Elsevier
Establishing dependable interconnects within thermoelectric (TE) modules is of utmost
significance in ensuring the longevity and functionality of these solid-state devices. PbTe …

The beneficial effect of Fe addition in PbTe-Ni diffusion bonded thermoelectric contact interfaces–A comprehensive phase evolution study

D Kumar, CA Muse, OE Femi, N Ravishankar… - Acta Materialia, 2023 - Elsevier
The development of reliable interconnects in thermoelectric (TE) modules is essential for the
durability and serviceability of these solid-state devices. PbTe-based devices are used in …