Due to the restriction of lead-rich solder and the miniaturization of electronic packaging
devices, lead-free solders have replaced lead-rich solders in the past decades; however, it …

The ballasless track has been massively applied nowadays, while the interface damage
evolution of ballastless tracks is still rarely investigated. This work aims to investigate the …

Rapid reliability analysis of the solder joints in the electronic devices identifies as an
appeared gap in the design stage. This paper demonstrates the feasibility of employing the …

Fatigue of lead-free solder joints remains the most critical concern in thermo-mechanical
reliability of high power modules. Due to size miniaturization requirements, fatigue …

This research investigated the effects of rapid thermal shock cycle on the internal cracks,
microstructure and internal cracks of SAC305 ball by applying non-destructive high energy …

Under the action of a complex and harsh working environment, the damage of the IGBT
power module's packaging interconnection structure is the primary failure mode. The crack …

The thermo-mechanical fatigue of different SAC+ solders is investigated using transient
thermal analysis (TTA) and predicted using artificial neural networks (ANN). TTA measures …

The issue of service life prediction of hot metallic components subjected to cyclic loadings is
addressed. Two classes of lifetime models are considered, namely, the incremental lifetime …

Experimental fracture mechanics at the microscale became an indispensable tool for
understanding and analyzing the solder joint degradation in microelectronics packaging …

A thermo-mechanical progressive analysis model is proposed for predicting fatigue-driven
delamination in composite laminated plates. The delamination is simulated based on …