Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-
chip communication bottleneck and improve performance over traditional two-dimensional …

With increasing application complexity and improvements in process technology, Chip
MultiProcessors (CMPs) with tens to hundreds of cores on a chip are becoming a reality …

Increasing application complexity and improvements in process technology have today
enabled chip multiprocessors (CMPs) with tens to hundreds of cores on a chip. Networks on …

This paper presents two novel methods for on-chip serial communication in which the clocks
of the transmitter and the receiver are generated with two separate ring oscillators. These …

On-chip global communication is required for data and control transfers across various
modules on the chip and determines the performance of the integrated circuit in current …

In this paper, we propose a mesochronous scheme for communication over serial buses in
network on chips (NoC). The technique, which removes metastability errors in …

A cell-based all-digital PWCL is presented in this paper. To improve design effort as well as
facilitate system-level integration, the new design can be developed in hardware description …

3D-ICs with through silicon vias (TSVs) allow multiplication of circuit capacities with constant
area footprint. This dissertation covers the optimization of on-chip communication networks …

With increasing application complexity and improvements in CMOS process technology,
chip multiprocessors (CMPs) with tens to hundreds of cores on a chip are today becoming a …

With increasing application complexity and improvements in process technology, multi-
processor systems-on-chip (MPSoC) with tens to hundreds of cores on a chip are being …