Abstract An acid Cu–Sn deposition bath was developed, and copper and copper–tin
coatings were electrodeposited on polycrystalline platinum. The effect of gelatin on copper …

Purpose The aim of this paper is to present a review of the tin whisker growth phenomena.
The study focuses mainly on whisker growth in a corrosive climate when the main inducing …

In this paper, the directional growth behavior of Sn whiskers was found to be associated with
the interfacial γ-Ag 2 Al IMCs at Sn-3.5 Ag/Al interface. A 100 μm thick columnar structured …

The processing of harvested waste heat obtained from industrial or domestic installations
directly converted into electrical energy using thermoelectric generators (TEG) is an …

In this paper, the relationship between the crystallographic structure of Cu-Sn intermetallic
grains and Sn whisker growth was investigated. In order to prevent the influence of the …

The effect of copper substrate roughness and tin layer thickness were investigated on
whisker development in the case of Sn thin-films. Sn was vacuum-evaporated onto both …

The effect of current load was investigated on corrosion induced tin whisker growth from
SnAgCu (SAC) solder alloys. Three alloys were studied: two low Ag content micro-alloyed …

Despite the coatings progress, addition of organic additives is limited or restricted in
electrolytes with environmental regulations. The electrochemical deposition of Cu-Sn alloy is …

The extrusion of Sn whiskers from Ti 2 SnC phase, a layered ternary carbide ceramic MAX
phase, has ultrafast whisker growth behaviors and good experimental repeatability. This …

Electromigration has become a critical issue for reliability in Sn-based conducting materials
that are used in advanced microelectronic packages with micro-joint integration. In this …