Boron nitride (BN) is an eminent inorganic compound having many interesting
characteristics such as improved oxidation resistance, mechanical strength, good thermal …

In this research project, the hexagonal boron nitride@(silver/copper)(h-BN@(Ag/Cu))
hybrids are successfully synthesized through a jointly decorated two-step process in this …

With the rapid development of electronic information technology in the 5G era towards high
integration, short propagation delay, and elevated assembly temperatures, more academic …

In the development of hexagonal boron nitride (h-BN)-based polymeric composites with high
thermal conductivity, it is always challenging to achieve a dense filling of h-BN fillers to form …

Polymer composites, with both high thermal conductivity and high electrical insulation
strength, are desirable for power equipment and electronic devices, to sustain increasingly …

The rapid development of electronics puts forward higher requirements on the low dielectric
materials. Especially, the polymer-based dielectric film with low dielectric constant, high …

As the base material of the printed circuit boards (PCBs), copper clad laminates (CCLs) with
high thermal conductivity, low dielectric loss and high peel strength have been greatly …

In this study, in-situ aluminum oxide-poly (dopamine)-silver (Al 2 O 3-PDA-Ag) hybrid
nanoparticles were synthesized using simple and eco-friendly approach. Al 2 O 3 …

High thermal conductivity composites with ideal electrical properties have a wide potential
application of electronic packaging systems in aerospace, electrical and electronic fields …

In this paper, we have designed strawberry-like core-shell structured aluminum oxide/tannic
acid-ferric ion/silver (Al 2 O 3/TA-Fe 3+/Ag) nanoparticles (NPs) and incorporated them into …