Integrated circuit chips and chip packages are disclosed that include an over-passivation
scheme at a top of the integrated circuit chip and a bottom scheme at a bottom of the …

As applications such as Apple Siri, Google Now, Microsoft Cortana, and Amazon Echo
continue to gain traction, web-service companies are adopting large deep neural networks …

This paper describes both a near term and a long term optical interconnect solution, the first
based on a packaging architecture and the second based on a monolithic photonic CMOS …

The time has passed when traditional MOSFET scaling techniques were adequate to meet
the needs of microprocessor products, but that has not meant the end of Moore's Law nor the …

(57) ABSTRACT A method of closely interconnecting integrated circuits con tained within a
semiconductor wafer to electrical circuits Surrounding the semiconductor wafer. Electrical …

Nehalem is a family of next-generation IA processors for mobile, desktop and server
segments implemented in 45nm high-kappa metal-gate CMOS. The family features a new …

H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid
state devices; Multistep manufacturing processes thereof the devices being of types …

This paper describes a 2.3 Billion transistors, 8-core, 16-thread, 64-bit Xeon® EX processor
with a 24 MB shared L3 cache implemented in a 45 nm nine-metal process. Multiple clock …

This paper presents a novel all-digital CDR scheme in 90 nm CMOS. Two independently
adjustable clock phases are generated from a delay line calibrated to 2 UI. One clock phase …

An image or light sensor chip package includes an image or light sensor chip having a non-
photosensitive area and a pho tosensitive area Surrounded by the non-photosensitive area …