[HTML][HTML] A coherent set of model equations for various surface and interface energies in systems with liquid and solid metals and alloys

G Kaptay - Advances in colloid and interface science, 2020 - Elsevier
In this paper first a generally valid model is derived from the two fundamental equations of
Gibbs for temperature and composition dependences of all types of interfacial energies. This …

The chemical (not mechanical) paradigm of thermodynamics of colloid and interface science

G Kaptay - Advances in Colloid and Interface Science, 2018 - Elsevier
In the most influential monograph on colloid and interfacial science by Adamson three
fundamental equations of “physical chemistry of surfaces” are identified: the Laplace …

Wettability and bonding of graphite by Sn0. 3Ag0. 7Cu-Ti alloys

W Fu, SP Hu, XG Song, JX Li, J Cao, JC Feng… - Carbon, 2017 - Elsevier
The wettability of graphite by SnAgCu-Ti alloys was investigated by sessile drop method in
vacuum. Bonding of graphite to itself using SnAgCu-Ti alloys was carried out and the joint …

Partial surface tension of components of a solution

G Kaptay - Langmuir, 2015 - ACS Publications
First, extending the boundaries of the thermodynamic framework of Gibbs, a definition of the
partial surface tension of a component of a solution is provided. Second, a formal …

Modelling equilibrium grain boundary segregation, grain boundary energy and grain boundary segregation transition by the extended Butler equation

G Kaptay - Journal of materials science, 2016 - Springer
The Butler equation is extended to model equilibrium grain boundary (GB) energy and the
equilibrium GB composition of a polycrystal, as a function of the following state parameters …

Wetting of grain boundary triple junctions by intermetallic delta-phase in the Cu–In alloys

B Straumal, O Kogtenkova, M Bulatov… - Journal of Materials …, 2021 - Springer
The paper studies the wetting of grain boundary triple junctions (GB TJs) by the second solid
phase (intermetallic) δ in the Cu–In alloys. In this system, the portion of grain boundaries in a …

Review of the wettability of solder with a wetting balance test for recent advanced microelectronic packaging

DH Jung, JP Jung - Critical Reviews in Solid State and Materials …, 2019 - Taylor & Francis
This paper reviewed the wetting properties of solder for microelectronic packaging. The
recent demand for high-density packaging has highlighted the need for a sophisticated and …

On the solid/liquid interfacial energies of metals and alloys

G Kaptay - Journal of materials science, 2018 - Springer
The solid/liquid interfacial energies of pure metals and metallic alloys are modelled in this
paper. A simple model is offered for pure metals, showing that their solid/liquid interfacial …

Containment materials for liquid tin at 1350° C as a heat transfer fluid for high temperature concentrated solar power

Y Zhang, Y Cai, SH Hwang, G Wilk, F DeAngelis… - Solar Energy, 2018 - Elsevier
One pathway for reducing the cost of concentrated solar power (CSP) is to increase the
system efficiency by operating a heat engine with a higher hot side (inlet) temperature. If a …

Bouncing dynamics of liquid drops impact on ridge structure: An effective approach to reduce the contact time

T Li, L Zhang, Z Wang, Y Duan, J Li… - Physical Chemistry …, 2018 - pubs.rsc.org
Surfaces designed so that liquid metals do not stick to them but instead rebound as soon as
possible have received considerable attention due to their significant importance in many …