Three-dimensional interconnected networks for thermally conductive polymer composites: Design, preparation, properties, and mechanisms
With the development of science and technology, microelectronic components have evolved
to become increasingly integrated and miniaturized. As a result, thermal management …
to become increasingly integrated and miniaturized. As a result, thermal management …
Carbon nanotubes and related nanomaterials: critical advances and challenges for synthesis toward mainstream commercial applications
Advances in the synthesis and scalable manufacturing of single-walled carbon nanotubes
(SWCNTs) remain critical to realizing many important commercial applications. Here we …
(SWCNTs) remain critical to realizing many important commercial applications. Here we …
Thermal conductivity of carbon nanotube networks: A review
Depending on their structure and order (individual, films, bundled, buckypapers, etc.),
carbon nanotubes (CNTs) demonstrate different values of thermal conductivity, from the …
carbon nanotubes (CNTs) demonstrate different values of thermal conductivity, from the …
Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management
Thermal management is the most critical technology challenge for modern electronics.
Recent key materials innovation focuses on developing advanced thermal interface of …
Recent key materials innovation focuses on developing advanced thermal interface of …
Thermal transport in polymeric materials and across composite interfaces
Thermal conduction in polymeric materials and across interfaces is of considerable scientific
and technological importance nevertheless only very few studies are available without …
and technological importance nevertheless only very few studies are available without …
Novel nanostructured thermal interface materials: a review
The trend of continuing miniaturisation of microelectronics leads to new thermal
management challenges. A key point in the heat removal process development is to improve …
management challenges. A key point in the heat removal process development is to improve …
Present and future thermal interface materials for electronic devices
Packaging electronic devices is a growing challenge as device performance and power
levels escalate. As device feature sizes decrease, ensuring reliable operation becomes a …
levels escalate. As device feature sizes decrease, ensuring reliable operation becomes a …
Thermal conduction phenomena in carbon nanotubes and related nanostructured materials
AM Marconnet, MA Panzer, KE Goodson - Reviews of Modern Physics, 2013 - APS
The extremely high thermal conductivities of carbon nanotubes have motivated a wealth of
research. Progress includes innovative conduction metrology based on microfabricated …
research. Progress includes innovative conduction metrology based on microfabricated …
Thermal conduction in aligned carbon nanotube–polymer nanocomposites with high packing density
Nanostructured composites containing aligned carbon nanotubes (CNTs) are very
promising as interface materials for electronic systems and thermoelectric power generators …
promising as interface materials for electronic systems and thermoelectric power generators …
Bonding‐Enhanced Interfacial Thermal Transport: Mechanisms, Materials, and Applications
Rapid advancements in nanotechnologies for energy conversion and transport applications
urgently require a further understanding of interfacial thermal transport and enhancement of …
urgently require a further understanding of interfacial thermal transport and enhancement of …