A Review of Recent Developments in “On-Chip” Embedded Cooling Technologies for Heterogeneous Integrated Applications
The electronics packaging community strongly believes that Moore's law will continue for
another few years due to recent technological efforts to build heterogeneously integrated …
another few years due to recent technological efforts to build heterogeneously integrated …
[HTML][HTML] High-efficiency cooling via the monolithic integration of copper on electronic devices
Electrification is critical to decarbonizing society, but managing increasing power
densification in electrical systems will require the development of new thermal management …
densification in electrical systems will require the development of new thermal management …
Multi-objective optimization of a chip-attached micro pin fin liquid cooling system
This study explores heat transfer from a chip-attached micro pin fin cooling device
undergoing water jet impingement where the silicon chip is in direct contact with the cooling …
undergoing water jet impingement where the silicon chip is in direct contact with the cooling …
Shape optimization of hotspot targeted micro pin fins for heterogeneous integration applications
In the field of high-performance computing (HPC), growing power demands makes
Heterogeneous Integration (HI) the future of next-generation computing systems to sustain …
Heterogeneous Integration (HI) the future of next-generation computing systems to sustain …
Orientation-dependent transport properties of Cu3Sn
Cu 3 Sn, a well-known intermetallic compound with a high melting temperature and thermal
stability, has found numerous applications in microelectronics, 3D printing, and catalysis …
stability, has found numerous applications in microelectronics, 3D printing, and catalysis …
Process-dependent anisotropic thermal conductivity of laser powder bed fusion AlSi10Mg: impact of microstructure and aluminum-silicon interfaces
Purpose AlSi10Mg alloy is commonly used in laser powder bed fusion due to its printability,
relatively high thermal conductivity, low density and good mechanical properties. However …
relatively high thermal conductivity, low density and good mechanical properties. However …
Performance analysis of impinging chip-attached micro pin fin direct liquid cooling package for hotspot targeted applications
As heterogeneous integration evolves, the diversity and density of devices that combine
multiple functionalities has significantly increased. The subsequent increase in power usage …
multiple functionalities has significantly increased. The subsequent increase in power usage …
Scaling Limits, Challenges, and Opportunities in Embedded Cooling
S Rangarajan, SN Schiffres… - Embedded Cooling of …, 2024 - World Scientific
Many packaging experts believe Moore's law will hold for another decade due to recent
technological efforts to merge multiple integrated circuit dies horizontally and vertically into a …
technological efforts to merge multiple integrated circuit dies horizontally and vertically into a …
Permeability of Additive Manufactured Cellular Structures—A Parametric Study on 17-4 PH Steels, Inconel 718, and Ti-6Al-4V Alloys
TW Liu, TL Cheng, KC Chiu, JK Chen - Journal of Manufacturing and …, 2022 - mdpi.com
Cellular structures of metallic alloys are often made for various industrial applications by
additive manufacturing. The permeability for fluid flow in these cellular structures is …
additive manufacturing. The permeability for fluid flow in these cellular structures is …
Fabrication of 3D metal-ceramic (Al-AlN) architectures using laser-powder bed fusion process
C Wallis, B Buchmayr, R Bermejo, P Supancic - Additive Manufacturing, 2021 - Elsevier
The potential of metal additive manufacturing for producing high conductivity materials and
hybrid systems for thermal management in opto-, power and microelectronics has been …
hybrid systems for thermal management in opto-, power and microelectronics has been …