Purpose This paper aims to review recent reports on mechanical properties of Sn-Bi and Sn-
Bi-X solders (where X is an additional alloying element), in terms of the tensile properties …

The current SMT reflow soldering process usually adopts experimental methods to predict
the temperature curve, and the disadvantages of high cost and low efficiency are urgent …

Amorphous Nisingle bondP layers have been employed as barrier layers to regulate the
formation and growth of intermetallic compounds (IMCs) within industrial contexts. The …

Purpose In this paper, a lifetime estimation model for the solder joint is proposed which is
capable of considering both severe and running mechanical shocks which is the real case in …

Pintaliitoksesta on tullut vallitseva tapa kiinnittää komponentteja piirilevykokoonpanojen
valmistuksessa. Automaattinen optinen tarkastus (AOT, engl. AOI, Automated Optical …

In this work, the effects of different components in the soldering flux with adding respectively
six organic acids on the self-alignment performance of Sn–3.0 Ag–0.5 Cu solder paste were …