This work firstly evaluated the microscale mechanical properties of sintered Ag, consisting of
various Ag particles of a flake shape and spherical shape from nano to micro size …

Sinter joining with Ag particle paste has emerged as a promising lead-free die-attachment
solution for power devices owing to its low-temperature and pressureless processing …

A one-step polyol method was employed to synthesize bimodal Cu particles with average
diameters around 200 nm and 1000 nm, respectively. The bimodal Cu particles were mixed …

In this work, we applied a Ag flake formed paste for sinter-joining on bare Si, SiC, and GaN
surfaces. The sintered joints possess a high shear strength of over 40 MPa under a …

A resin-free paste containing 1.5 μm Cu@ Ag particles was fabricated and used to form a
film with excellent electrical conductivity even after a significantly high-speed sintering …

Micron Ag paste had a more affordable price, feasible large-scale synthesis, and longer
storage life compared to nano Ag paste, thus it attracts much industrial interest for die …

Robust bonding and thermal-stable sinter Ag joining on an Au finished substrate was first
time achieved for use in SiC power modules. Five kinds of Ag paste, including different …

To promptly form a bondline with high thermal stability and thermal conductivity using a
small amount of expensive Ag, dies were attached to Ag finishes by pressure-assisted sinter …

Micron silver paste enables a low-temperature and pressureless sintering process by using
an ether-type solvent CELTOL-IA (C x H y O z, x> 10, boiling point of approximately 200° C) …

In the silver sinter joining process, not only the bonding materials but also the metallization
layer play important roles in bonding reliability. Compared with Ag, Au is utilized less often …