On the plane receding contact between two functionally graded layers using computational, finite element and artificial neural network methods
E Öner, B Şengül Şabano… - ZAMM‐Journal of …, 2022 - Wiley Online Library
The frictionless double receding contact problem for two functionally graded (FG) layers
pressed by a uniformly distributed load is addressed in this paper. The gradation in the …
pressed by a uniformly distributed load is addressed in this paper. The gradation in the …
Investigation of continuous and discontinuous contact cases in the contact mechanics of graded materials using analytical method and FEM
The aim of this paper was to examine the continuous and discontinuous contact problems
between the functionally graded (FG) layer pressed with a uniformly distributed load and …
between the functionally graded (FG) layer pressed with a uniformly distributed load and …
The interfacial behavior of a thermoelectric thin-film bonded to an orthotropic substrate
D Li, P Chen, Z Huang, H Liu, S Chen - International Journal of Solids and …, 2023 - Elsevier
The thermoelectric film/substrate structure has recently drawn great attention due to various
applications in fields of sensors in scramjet engines, power generation, refrigeration and …
applications in fields of sensors in scramjet engines, power generation, refrigeration and …
On the analytical and finite element solution of plane contact problem of a rigid cylindrical punch sliding over a functionally graded orthotropic medium
This study investigates the plane frictional contact problem of a cylindrical punch on a
functionally graded orthotropic medium (FGOM). Both analytical and computational methods …
functionally graded orthotropic medium (FGOM). Both analytical and computational methods …
Contact problem for a functionally graded layer indented by a moving punch
İ Çömez - International Journal of Mechanical Sciences, 2015 - Elsevier
In this study moving contact problem for a rigid cylindrical punch and a functionally graded
layer is considered. The punch subjected to concentrated normal force, and moves steadily …
layer is considered. The punch subjected to concentrated normal force, and moves steadily …
Frictional receding contact problem for a graded bilayer system indented by a rigid punch
The frictional receding contact problem for two graded layers pressed by a rigid punch is
considered in this paper. The punch is subjected to both normal and tangential loads …
considered in this paper. The punch is subjected to both normal and tangential loads …
The interface behavior of a thin piezoelectric film bonded to a graded substrate
P Chen, S Chen, W Guo, F Gao - Mechanics of Materials, 2018 - Elsevier
A theoretical model of a thin piezoelectric film bonded to a graded substrate under an in-
plane electrical loading is established, in which the shear modulus of the graded substrate is …
plane electrical loading is established, in which the shear modulus of the graded substrate is …
Modeling the line contact on an elastic half-space with the statistical approach: Self-affine fractal roughness and numerical framework
This paper presents a line contact model for describing the normal contact between rough
surfaces with self-affine fractal roughness based on the statistical approach. An iterative …
surfaces with self-affine fractal roughness based on the statistical approach. An iterative …
The receding contact problem of two elastic layers supported by two elastic quarter planes
The receding contact problem for two elastic layers whose elastic constants and heights are
different supported by two elastic quarter planes is considered. The lower layer is supported …
different supported by two elastic quarter planes is considered. The lower layer is supported …
The thermally induced interfacial behavior of a thin two-dimensional decagonal quasicrystal film
In this paper, the interfacial behavior of a thin two-dimensional decagonal quasicrystal (QC)
film bonded on an elastic substrate is investigated due to a material mismatch strain under …
film bonded on an elastic substrate is investigated due to a material mismatch strain under …