The stress response to random vibrations is an important factor to be taken into account in
designing embedded electronic devices. Several test specifications and qualifications use …

The built-in stress test (BIST) is extensively used for diagnostics or identification of failure.
The current version of BIST approach is focused on reactive failure detection and provides …

Electronics may be subjected to shock, vibration, and drop-impact during shipping, handling
and during normal usage. Measurement of transient dynamic deformation of the electronics …

Abstract System-in-Package (SiP) is a cutting-edge packaging technique that is flourishing
in the semiconductor sector. Physical testing, which can be time-consuming and lead to …

Relative damage-index based on the leadfree interconnect transient strain history from
digital image correlation, explicit finite-elements, cohesive-zone elements, and component's …

A technique has been developed for monitoring the structural damage accrued in ball grid
array interconnects during operation in vibration environments. The technique uses …

In this paper, a design-envelope approach based on optical feature extraction techniques
has been investigated for drop and shock survivability of electronic packaging has been …

Structural damage to BGA interconnects incurred during vibration testing has been
monitored in the pre-failure space using resistance spectroscopy based state space vectors …

Solid-shell formulations based on reduced integration with hourglass stabilization have
several advantages. Among these are the smaller number of Gauss points and the direct …

This article is dedicated to the review of publications on drop impact analysis performed on
consumer electronic devices such as cellular phones and two-way radios in the past …