The state-of-the-art development and subsequent miniaturization of technologies in e-
systems such as computers and digital communication systems have led to densely and …

The paper proposes glass as a potential material to advanced interposers for high-density
three-dimensional (3-D) integration. On the basis of multi-bit through glass via (TGV) which …

In this work, performance of dielectric inserted side contact multilayer graphene nanoribbon
(Di‐side‐GNR) coupled interconnects using unconditionally stable finite‐difference time …

In the present work, for examining the performance of dielectric inserted side contact
multilayer graphene nano ribbon (DSMLGNR), a novel Unconditionally Stable Finite …

Although they have better electrical and thermal properties, thermal issues have become an
important challenge to design modern integrated circuits with single‐walled carbon …

With significant reduction in the size of ICs, there has been a massive increase in the
operating speed. Due to this condition, the area available for interconnects within the …

This paper presents the investigations of crosstalk effects in ternary logic‐based coupled
interconnects. The crosstalk analysis is investigated for coupled copper interconnects and …

In this paper, the performance of intercalation doped multilayer graphene nanoribbons
(MLGNR) with reduced vertical thickness is investigated, and the impact of crosstalk on …

Density functional theory (DFT) together with non-equilibrium Green's function (NEGF) is
used for the theoretical investigation of structural, electronic, and transport properties of …

In this work, the performance of copper (Cu), dielectric inserted horizontal graphene
nanoribbon (Di-HGNR) interconnect and dielectric inserted vertical graphene nanoribbon …