The escalating demands of high-frequency applications demands the development of
dielectric materials with low relative permittivity (dielectric constant) for efficient signal …

Integrated circuits (ICs) are challenged to deliver historically anticipated performance
improvements while increasing the cost and complexity of the technology with each …

Polymers with low dielectric permittivity and dielectric loss are essential for the microelectrics
and wireless communication industries. The perfluorocyclobutyl (PFCB) aryl ether group has …

In the last decade, various materials and nanoscale modifications have been developed to
enhance the performance of the triboelectric nanogenerators (TENGs). Electrospinning of …

Low‐dielectric‐constant materials such as silicon dioxide serving as interconnect insulators
in current integrated circuit face a great challenge due to their relatively high dielectric …

Most common flame retardants have high polarizability, so introducing flame retardants with
simple structures to simultaneously improve the flame retardancy and dielectric properties of …

Comprehensive Summary Low dielectric (low‐k) organosilicon polymers have received
extensive interests from industry and academia due to good electrical insulation, high …

With the rapid development and application of 5G technology, design and fabrication of
lightweight polymer materials with excellent flame retardancy, low dielectric constant, and …

Porous polymer materials with low dielectric constant, dielectric loss and excellent
mechanical properties are expected to be widely used in the field of microelectronic devices …

This study provides a comprehensive overview of the preparation methods for polyhedral
oligomeric silsesquioxane (POSS) monomers and polymer/POSS nanocomposites. It …