Heat transfer continues to be a major field of interest to engineering and scientific
researchers, as well as designers, developers, and manufacturers. The wealth of …

When a high-speed moving object is subjected to high-intensity vibration shocks and a
sharp rise in temperature, the internal electronic components (Printed Circuit Board) will …

In the past decade, we have observed a significant worldwide increase in the use of
computational codes to calculate the thermal behavior of electronic systems. The benefits of …

Flexible printed circuit boards (FPCBs) are being used extensively in current electronics
devices because of their excellent flexibility, light weight, and reduced thickness. In the …

A flexible printed circuit board (FPCB) is flexible, thin and lightweight; however, FPCBs
experience more deflection and stress in the flow environment because of fluid–structure …

Numerical predictive accuracy is assessed for component-printed circuit board (PCB) heat
transfer in forced convection using a widely used computational fluid dynamics (CFD) …

Developing virtual perfonnance-and reliability predictive techniques has become essential
for the development of (micro) electronic systems. This paper provides an overview of …

The aim of the proposed paper is the development of an electro-thermal model of
semiconductor component using an indirect modelling approach. The approach is based on …

The desire of flexibility, compact, lightweight and low cost in current electronic device
increases the application of flexible printed circuit board (FPCB). However, FPCB would …

This study aims to provide a perspective on the current capabilities of computational fluids
dynamics (CFD) as a design tool to predict component operating temperature in electronic …