Overview of transient liquid phase and partial transient liquid phase bonding
GO Cook III, CD Sorensen - Journal of materials science, 2011 - Springer
Transient liquid phase (TLP) bonding is a relatively new bonding process that joins
materials using an interlayer. On heating, the interlayer melts and the interlayer element (or …
materials using an interlayer. On heating, the interlayer melts and the interlayer element (or …
A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging
HK Kannojia, P Dixit - Journal of Materials Science: Materials in …, 2021 - Springer
Abstract In recent years, Cu–Sn solid–liquid interdiffusion (SLID) bonding has been used in
semiconductor packaging, die-attach, fine-pitch interconnection, and through-silicon vias …
semiconductor packaging, die-attach, fine-pitch interconnection, and through-silicon vias …
Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process
JF Li, PA Agyakwa, CM Johnson - Acta materialia, 2011 - Elsevier
A thin interlayer of pure Sn foil has been sandwiched between two pieces of Cu foil base
metal and reflowed at 260, 300 and 340° C, under 2% H2/98% N2 forming gas, for 5 …
metal and reflowed at 260, 300 and 340° C, under 2% H2/98% N2 forming gas, for 5 …
High-temperature lead-free solder alternatives
For lead-free solders in the high-temperature regime, unfortunately, a limited number of
alloying systems are available. These are Bi based alloys, gold involving alloys and Zn–Al …
alloying systems are available. These are Bi based alloys, gold involving alloys and Zn–Al …
Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process
JF Li, PA Agyakwa, CM Johnson - Acta Materialia, 2010 - Elsevier
The kinetics of the interfacial reaction of a thin layer of Sn sandwiched between two pieces
of Ag foil has been investigated at temperatures of 260° C, 300° C and 340° C. A time …
of Ag foil has been investigated at temperatures of 260° C, 300° C and 340° C. A time …
Preliminary exploration of key technique for the application of thermoelectric SnTe in mid-temperature power generation
As a kind of environment-friendly mid-temperature thermoelectric materials, SnTe-based
alloy has been widely studied in recent years, but so far, the module catering to mid …
alloy has been widely studied in recent years, but so far, the module catering to mid …
A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding
K Chu, Y Sohn, C Moon - Scripta Materialia, 2015 - Elsevier
Two sandwich structured solder systems (Cu/Sn/Cu and Ni/Sn/Ni) were investigated in terms
of interfacial reaction and mechanical reliability for low temperature wafer bonding. The …
of interfacial reaction and mechanical reliability for low temperature wafer bonding. The …
Morphological and mechanical behaviour of Cu–Sn alloys—a review
M Karthik, J Abhinav, KV Shankar - Metals and Materials International, 2021 - Springer
The current paper reviews the research conducted on wrought Cu–Sn, Cu–Sn–Ti and Cu–
Sn–Zn alloys intending to reveal the details on morphological and mechanical behaviour …
Sn–Zn alloys intending to reveal the details on morphological and mechanical behaviour …
Materials, processing and reliability of low temperature bonding in 3D chip stacking
Due to the advantages of small form factor, high performance, low power consumption, and
high density integration, three-dimensional integrated circuits (3D ICs) have been generally …
high density integration, three-dimensional integrated circuits (3D ICs) have been generally …
A review: Formation of voids in solder joint during the transient liquid phase bonding process-Causes and solutions
O Mokhtari - Microelectronics Reliability, 2019 - Elsevier
Transient liquid phase (TLP) bonding is a bonding technique that has attracted several
applications in high-temperature electronics, in particular, power electronics packaging. The …
applications in high-temperature electronics, in particular, power electronics packaging. The …