Transient liquid phase (TLP) bonding is a relatively new bonding process that joins
materials using an interlayer. On heating, the interlayer melts and the interlayer element (or …

Abstract In recent years, Cu–Sn solid–liquid interdiffusion (SLID) bonding has been used in
semiconductor packaging, die-attach, fine-pitch interconnection, and through-silicon vias …

A thin interlayer of pure Sn foil has been sandwiched between two pieces of Cu foil base
metal and reflowed at 260, 300 and 340° C, under 2% H2/98% N2 forming gas, for 5 …

For lead-free solders in the high-temperature regime, unfortunately, a limited number of
alloying systems are available. These are Bi based alloys, gold involving alloys and Zn–Al …

The kinetics of the interfacial reaction of a thin layer of Sn sandwiched between two pieces
of Ag foil has been investigated at temperatures of 260° C, 300° C and 340° C. A time …

As a kind of environment-friendly mid-temperature thermoelectric materials, SnTe-based
alloy has been widely studied in recent years, but so far, the module catering to mid …

Two sandwich structured solder systems (Cu/Sn/Cu and Ni/Sn/Ni) were investigated in terms
of interfacial reaction and mechanical reliability for low temperature wafer bonding. The …

The current paper reviews the research conducted on wrought Cu–Sn, Cu–Sn–Ti and Cu–
Sn–Zn alloys intending to reveal the details on morphological and mechanical behaviour …

Due to the advantages of small form factor, high performance, low power consumption, and
high density integration, three-dimensional integrated circuits (3D ICs) have been generally …

Transient liquid phase (TLP) bonding is a bonding technique that has attracted several
applications in high-temperature electronics, in particular, power electronics packaging. The …