Adhesion–delamination phenomena at the surfaces and interfaces in microelectronics and MEMS structures and packaged devices
VK Khanna - Journal of Physics D: Applied Physics, 2010 - iopscience.iop.org
Physico-chemical mechanisms of adhesion and debonding at the various surfaces and
interfaces of semiconductor devices, integrated circuits and microelectromechanical systems …
interfaces of semiconductor devices, integrated circuits and microelectromechanical systems …
An iterative fuzzy controller for pneumatic muscle driven rehabilitation robot
Pneumatic muscle actuators (PMA) show great potential in wearable and compliant
rehabilitation devices as they are flexible and lightweight. However, the varying and non …
rehabilitation devices as they are flexible and lightweight. However, the varying and non …
Optimal FSW process parameters for interface and welded zone toughness of dissimilar aluminium–steel joint
TP Chen, WB Lin - Science and Technology of Welding and …, 2010 - Taylor & Francis
The main purpose of this paper is to determine the optimum operating conditions of friction
stir welding dissimilar metals joints, namely AA6061 aluminium alloy and SS400 low carbon …
stir welding dissimilar metals joints, namely AA6061 aluminium alloy and SS400 low carbon …
Surface metallization of alumina ceramics: Effects of sintering time and substrate etching
Z Zheng, Y Zhang, F Yi, C Chen, X Song - Ceramics International, 2014 - Elsevier
Surface metallization of alumina ceramics was prepared by a screen-printing process. The
effects of sintering time and substrate etching on the morphology, surface resistivity and …
effects of sintering time and substrate etching on the morphology, surface resistivity and …
Effects of brazing technology on hermeticity of alumina ceramic-metal joint used in nuclear power plants
N Deng, J Zhao, L Yang, Z Zheng - Frontiers in Materials, 2021 - frontiersin.org
Taking the brazing mechanism of alumina ceramics and kovar alloys as the main research
object, based on the molybdenum–manganese metallization method, the influence of the …
object, based on the molybdenum–manganese metallization method, the influence of the …
Surface roughness effect on copper–alumina adhesion
JD Lim, YSY Susan, RMW Daniel, KC Leong… - Microelectronics …, 2013 - Elsevier
The surface roughness of the substrate itself could play an important role for the bonding at
the interface. In this paper, a correlation of the surface roughness of a rigid alumina …
the interface. In this paper, a correlation of the surface roughness of a rigid alumina …
A new approach for assessing the reliability of electronic assemblies using fuzzy logic for multi-criteria optimization
R Al Athamneh, F Akkara… - … of Microelectronics and …, 2022 - meridian.allenpress.com
The reliability of electronic assemblies is a vital criterion used to assure product quality over
its lifetime. Weibull distribution is the most common distribution utilized to describe the …
its lifetime. Weibull distribution is the most common distribution utilized to describe the …
氧化铝陶瓷高温银浆表面金属化研究
郑志勤, 易发成, 王哲 - 陶瓷, 2014 - cqvip.com
电子银浆料是通过丝网印刷工艺预先均匀分布在氧化铝陶瓷板表面. 笔者通过四探针测试法和背
散射电子成像分别研究了烧结保温时间和基板腐蚀情况对银金属化层的形貌 …
散射电子成像分别研究了烧结保温时间和基板腐蚀情况对银金属化层的形貌 …
Reliability modeling of microelectronic interconnections in long-term applications
R Al Athamneh - 2019 - search.proquest.com
Solder alloy materials are used to form mechanical and electrical connections between
printed circuit boards and electronic components. Enhancing the reliability of electronic …
printed circuit boards and electronic components. Enhancing the reliability of electronic …
A New Approach for Assessing the Reliability of Electronic Assemblies Using Fuzzy Logic for Multi-criteria Optimization.
RA Athamneh, F Akkara… - Journal of Microelectronic …, 2022 - search.ebscohost.com
The reliability of electronic assemblies is a vital criterion used to assure product quality over
its lifetime. Weibull distribution is the most common distribution utilized to describe the …
its lifetime. Weibull distribution is the most common distribution utilized to describe the …