CMOS-compatible fine pitch Al-Al bonding
HK Cheemalamarri, B Varghese… - 2023 IEEE 73rd …, 2023 - ieeexplore.ieee.org
The metal-metal bonding has become more promising for fine-line hermitic sealing and
electronic packaging applications. Even though aluminum has CMOS compatibility and …
electronic packaging applications. Even though aluminum has CMOS compatibility and …
Low-temperature anodic bonding for wafer-level Al–Al interconnection in MEMS grating gyroscope
F Hao, J Wang, M Li - IEEE Transactions on Components …, 2020 - ieeexplore.ieee.org
In this article, low-temperature anode bonding technology is used to realize wafer-level Al–
Al interconnection in MEMS grating gyroscope. The gyroscope structure was fabricated on …
Al interconnection in MEMS grating gyroscope. The gyroscope structure was fabricated on …
A low-temperature nickel silicide process for wafer bonding and high-density interconnects
MA Smith, E Holihan, BP Duncan… - IEEE Transactions …, 2020 - ieeexplore.ieee.org
Wafer-scale heterogeneous integration provides a viable pathway for the development of
highly capable microsystems. However, it remains challenging to integrate die-and wafer …
highly capable microsystems. However, it remains challenging to integrate die-and wafer …
Aluminum-Aluminum Wafer Level Thermo Compression Bonding Using Thick Electroplated Aluminum Bonding Frames
Wafer bonding is crucial in semiconductor manufacturing, integrating diverse materials and
creating complex devices. Aluminum thermo-compression bonding (Al TCB) is promising for …
creating complex devices. Aluminum thermo-compression bonding (Al TCB) is promising for …
Full-wave RF modeling of a fan-out wafer-level packaging technology based on Al-Al wafer bonding
M Stocchi, M Wietstruck, S Schulze… - 2020 IEEE 20th …, 2020 - ieeexplore.ieee.org
The transmission loss of a test structure, composed of a series of 18 CPW-based
interconnections in between a High-Resistive Silicon (HRSi) interposer and a SiGe …
interconnections in between a High-Resistive Silicon (HRSi) interposer and a SiGe …
Millimetre-Wave and Terahertz Antennas and Directional Coupler Enabled by Wafer-Level Packaging Platform with Interposer
The recent development of wafer-level, low-cost packaging platforms based on the silicon
interposer and direct wafer bonding has paved a new way toward high-performance …
interposer and direct wafer bonding has paved a new way toward high-performance …
SiGe BiCMOS technology with embedded through-silicon vias and interposer fan-out wafer-level packaging platform
M Wietstruck, S Marschmeyer… - … Conference in Central …, 2019 - ieeexplore.ieee.org
In this paper, the latest developments of a high performance SiGe BiCMOS technology with
embedded Through-Silicon Vias and an additional Fan-out Wafer-level Packaging platform …
embedded Through-Silicon Vias and an additional Fan-out Wafer-level Packaging platform …