The bonding mechanisms of gold, to give the desired strength of wire bonding, still require
detailed investigation, including establishing adequate and reliable testing procedures. The …

The effect of bonding duration and substrate temperature on the nano-scale interfacial
structure for bonding strength were investigated using high resolution transmission electron …

The effect of ultrasonic vibration on nanoscale interfacial structure of thermosonic copper
wire bonding on aluminium pads was investigated. It was found that bonding strength was …

The efficiencies of argon radio frequency [Ar (RF)] and argon microwave [Ar (MW)] plasma
treatments were compared in terms of contaminant removal and wire bond interfacial …

The aim of this study is to identify the bonding mechanisms of the ultrasonic Al bond on the
Mo back-contact layer (Al-Mo system) of a copper indium gallium (de) selenide (CIGS) thin …

The semiconductor industry in Taiwan has received excellent performance ratings in the
past. SinoPac's statistics in January, 2016 found that two of the top four global packaging …

Purpose–This paper aims to analyze the effect of Au wire size and location of hook during
wire pulling test to identify the variation of results obtained. Design/methodology/approach …

Investigates the mechanical and electronic properties of two-dimensional nanomaterials
under strain, addressing gaps in the existing literature. The primary challenge with these …

In this study, Cu wire-Al bond pad (Cusingle bond Al) samples were produced by means of
Thermosonic wire bonding technique. Both IMC and ball shear strength were assessed for …

Life time prediction of power electronic modules is becoming increasingly important in order
to reduce unscheduled maintenance and unexpected failures. Recent developments in life …