A method of cutting a semiconductor wafer by selectively controlling and utilising the
polarization of incident laser beam or beams, comprising irradiating the semiconductor …

A processing device for processing a material with a focused blasting medium, having at
least a blasting medium source for generating the blasting medium and a conveying device …

A display device may include the following elements: a first substrate; a first polarizer; a
second substrate overlapping the first substrate and overlapping the first polarizer; and a …

To reduce a width of a modified layer and suppress positional variation of the modified layer,
a crystal orientation of a workpiece is measured, a vertical direction with respect to an A …

A laser processing apparatus includes an irradiation portion, and a controller. The irradiation
portion includes a shaping portion configured to shape the laser light. The controller …

A laser processing apparatus includes a support portion, a laser processing head, a vertical
movement mechanism, a horizontal movement mechanism, and a controller. The controller …

A method of repairing a display panel comprising: deter mining a pixel where a bright spot
defect resides and a position of the bright spot in the pixel; setting a repair region, the repair …

Disclosed is a method for cutting dielectric or semiconducting material with a laser. The
method includes the following steps: emission of a laser beam including at least one burst of …

WO2020090909A1 - レーザ加工装置 - Google Patents WO2020090909A1 - レーザ加工装置 -
Google Patents レーザ加工装置 Download PDF Info Publication number WO2020090909A1 …