During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and
through-hole technology assemblies in IBM mainframe due to its unique low temperature …

Sn–Bi-based solder alloys have sparked tremendous research interest towards the
development of low-temperature interconnecting materials in multi-level packaging …

Cu-foam sheets with the thicknesses of 0.15 mm and 0.5 mm were utilized as strengthening
structure to improve the performances of the Sn3. 0Ag0. 5Cu (SAC305)/Cu solder joints. The …

This study delves into the intricate interaction between multi-walled carbon nanotubes
(MWCNTs) and the Sn–Ag–Cu solder system, highlighting its relevance in lead-free …

Aiming to solve the intrinsic brittleness of Sn–Bi solder alloy, the effects of In element on the
microstructure evolution, mechanical and soldering properties were systematically …

The mass reflow (MR) process is widely used in electronic packaging interconnection.
However, the conventional MR process can cause thermal damage to components and …

The low melting temperature In-48Sn alloy is a promising candidate for flexible devices.
However, the joint strength of the In-48Sn alloy on the Cu substrate was low due to the rapid …

Abstract Creep damage of Sn–Ag–Cu micro-joints is inevitable in service, even at room
temperature. In this study, Ni-decorated reduced graphene oxide (Ni-RGO) nanosheets …

In order to satisfy the needs of electronic industries for high-reliability joints, different kinds of
nanoparticles were incorporated into conventional Pb-free solders to enhance the …