Recent progress in quantum photonic chips for quantum communication and internet

W Luo, L Cao, Y Shi, L Wan, H Zhang, S Li… - Light: Science & …, 2023 - nature.com
Recent years have witnessed significant progress in quantum communication and quantum
internet with the emerging quantum photonic chips, whose characteristics of scalability …

The future of computing beyond Moore's Law

J Shalf - Philosophical Transactions of the Royal Society …, 2020 - royalsocietypublishing.org
Moore's Law is a techno-economic model that has enabled the information technology
industry to double the performance and functionality of digital electronics roughly every 2 …

Integrated photonics packaging: challenges and opportunities

L Ranno, P Gupta, K Gradkowski, R Bernson… - ACS …, 2022 - ACS Publications
Packaging of photonic integrated circuit (PIC) chips is an essential and critical step before
they can be integrated into functional optoelectronic systems. Photonic packaging is …

Peta-scale embedded photonics architecture for distributed deep learning applications

Z Wu, LY Dai, A Novick, M Glick, Z Zhu… - Journal of Lightwave …, 2023 - ieeexplore.ieee.org
As Deep Learning (DL) models grow larger and more complex, training jobs are
increasingly distributed across multiple Computing Units (CU) such as GPUs and TPUs …

Constructal design for the layout of multi-chip module based on thermal-flow-stress coupling calculation

G Nan, Z Xie, X Guan, X Ji, D Lin - Microelectronics Reliability, 2021 - Elsevier
The thermal-flow-stress coupling model of multi-chip module with uniform heat generation
under natural convection condition is established. Taking the chip aspect ratio and edge …

PINE: photonic integrated networked energy efficient datacenters (ENLITENED program)

M Glick, NC Abrams, Q Cheng, MY Teh… - Journal of Optical …, 2020 - opg.optica.org
We review the motivation, goals, and achievements of the Photonic Integrated Networked
Energy efficient datacenter (PINE) project, which is part of the Advanced Research Projects …

PolarFly: a cost-effective and flexible low-diameter topology

K Lakhotia, M Besta, L Monroe, K Isham… - … Conference for High …, 2022 - ieeexplore.ieee.org
In this paper we present PolarFly, a diameter-2 network topology based on the Erdos-Renyi
family of polarity graphs from finite geometry. This is the first known diameter-2 topology that …

Glass platform for co-packaged optics

L Brusberg, JR Grenier, AR Zakharian… - IEEE Journal of …, 2023 - ieeexplore.ieee.org
Placing the electrical and photonic chiplets in a single package leads to significant power
reduction. Chiplets are connected by fine-line electrical routing over a length of a few …

[PDF][PDF] 大数据时代光电共封技术的机遇与挑战

卞玲艳, 曾燕萍, 蔡莹, 陆霄, 周倩蓉… - Laser & …, 2024 - researching.cn
摘要人工智能和大数据时代对数据存储, 传输和处理能力的需求日益增加, 数据传输所需带宽和
通信速率也随之增加. 然而系统级封装中的电互连受到介质材料, 传输速率的影响 …

Fast FBG interrogator on chip based on silicon on insulator ring resonator add/drop filters

L Tozzetti, F Bontempi, A Giacobbe… - Journal of Lightwave …, 2022 - opg.optica.org
A fast FBG sensor interrogator on chip based on SOI ring resonator (RR) filters is presented.
The measurement of the Bragg wavelength shift is based on the detection of multiple signals …