The simulated TDR impedance in PCB material characterization

Y Guo, DH Kim, J He, S Yong, Y Liu… - … Joint EMC/SI/PI and …, 2021 - ieeexplore.ieee.org
High-speed PCB design for signal integrity (SI) is about feasible material selection, trace
geometry determination and optimization of discontinuities, where the accurate PCB …

Surface roughness effect from different surfaces of microstrip lines and reference plane

Y Liu, Y Guo, C Li, X Ye, D Kim - IEEE Letters on …, 2023 - ieeexplore.ieee.org
Microstrip line structures consist of different conductors, such as trace and reference planes,
which have different surface roughness levels due to the printed-circuit board manufacturing …

Far-end crosstalk control strategy for high-volume high-speed PCB manufacturing: The concept of critical resin content percent

Y Guo, S Yong, Y Liu, J He, B Pu, X Ye… - … Joint EMC/SI/PI and …, 2021 - ieeexplore.ieee.org
Far-end crosstalk (FEXT) can reduce the eye opening and eventually decrease the
maximum data rate that can be transmitted through the high-speed interconnections …

Insertion loss reduction using rounded corners to mitigate surface roughness effect in PCB transmission lines

Y Guo, DH Kim, Y Liu, X Ye, J Hsu… - 2022 Asia-Pacific …, 2022 - ieeexplore.ieee.org
Signal integrity (SI) can be interpreted as a measure of the distortion of the incident pulse,
which is attributed to various contributors, eg, inter-symbol interference (ISI), crosstalk, jitter …

Effects of Non-Gaussian Surface Roughness on Conductor Loss in High-Frequency Transmission Lines

Z Yang, Y Zhu, H Jiang, H Bao… - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
A simulation method is proposed to study the impacts of surface roughness with additional
features, skewness, and kurtosis on the conductor loss in high-frequency transmission lines …

Dielectric constant extraction for microstrip transmission lines based on S-parameter measurements and cross-section

Y Liu, S Yong, J Li, V Khilkevich - … Joint EMC/SI/PI and EMC …, 2021 - ieeexplore.ieee.org
In this paper, a new dielectric constant extraction method for the microstrip substrate material
is proposed, which is based on measured S-parameter and cross-section analysis of the …

Disentangling superconductor and dielectric microwave losses in sub-micron / interconnects using a multi-mode microstrip resonator

CAT Garcia, N Bailey, C Kirby, JA Strong… - arXiv preprint arXiv …, 2023 - arxiv.org
Understanding the origins of power loss in superconducting interconnects is essential for the
energy efficiency and scalability of superconducting digital logic. At microwave frequencies …

Modeling Transmission Lines Using a Hybrid Knowledge-Based and Data-Driven Approach

Y Zhang, L Jiang - IEEE Transactions on Signal and Power …, 2022 - ieeexplore.ieee.org
This article presents a novel hybrid knowledge-based and data-driven scheme to determine
the governing partial differential equation (PDE) for the transmission line (TL). The two …

[图书][B] EMI characterization for power supplies and machine learning based modeling in EMC/SI

J He - 2021 - search.proquest.com
Signal integrity (SI) and electromagnetic interference (EMI) are essential for consumer
electronics and high-speed server applications. It is necessary to do EMI and SI modeling at …

Plasmonic Boundary Condition Optimization applied to Nanoscale IR Antenna Structure Simulations

A Sanford - 2022 IEEE International Symposium on Antennas …, 2022 - ieeexplore.ieee.org
We explore the use of best fit impedance boundary conditions (IBCs) for use in
electromagnetic structure simulators in realms where IBCs are not readily applicable. In …