Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
TJ Colosimo, DP Buergi, H Claubeg… - US Patent …, 2019 - Google Patents
A method of operating a bonding machine is provided. The method includes the steps of:(a)
carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor …
carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor …
Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor device
D Nagatomo, F Moroishi, M Izumita, S Ueyama… - US Patent …, 2024 - Google Patents
An apparatus for manufacturing a semiconductor device includes a bonding head
configured to adsorb and hold a mounting component at a pick-up position, to move …
configured to adsorb and hold a mounting component at a pick-up position, to move …
Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
TJ Colosimo, DP Buergi, H Clauberg… - US Patent …, 2018 - Google Patents
A method of operating a bonding machine is provided. The method includes the steps of:(a)
carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor …
carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor …