Semiconductor device under bump structure and method therefor
TN Lo, SHL Tay, AAM Macatangay - US Patent 11,728,308, 2023 - Google Patents
A method of manufacturing a semiconductor device is provided. The method includes
depositing a non-conductive layer over a semiconductor die. An opening is formed in the …
depositing a non-conductive layer over a semiconductor die. An opening is formed in the …