A thorough review of cooling concepts and thermal management techniques for automotive wbg inverters: Topology, technology and integration level

E Abramushkina, A Zhaksylyk, T Geury, M El Baghdadi… - Energies, 2021 - mdpi.com
The development of electric vehicles (EVs) is an important step towards clean and green
cities. An electric powertrain provides power to the vehicle and consists of a charger, a …

A highly integrated multichip SiC MOSFET power module with optimized electrical and thermal performances

D Ma, G Xiao, T Zhang, F Yang, M Zhu… - IEEE Journal of …, 2022 - ieeexplore.ieee.org
This paper proposes a highly integrated multichip silicon carbide (SiC) MOSFET power
module packaging with optimized electrical and thermal performances. The structure of the …

Numerical simulation and analytical modeling of the thermal behavior of single-and double-sided cooled power modules

AP Catalano, C Scognamillo… - IEEE Transactions …, 2020 - ieeexplore.ieee.org
This article presents the detailed thermal analysis and modeling of multichip power modules
(PMs). For the first time, a fair thermal comparison between the widespread single-sided …

Circuit-based electrothermal simulation of multicellular SiC power MOSFETs using FANTASTIC

V d'Alessandro, L Codecasa, AP Catalano… - Energies, 2020 - mdpi.com
This paper discusses the benefits of an advanced highly-efficient approach to static and
dynamic electrothermal simulations of multicellular silicon carbide (SiC) power MOSFETs …

A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters

R Paul, R Alizadeh, X Li, H Chen… - … on Power Electronics, 2024 - ieeexplore.ieee.org
Double-sided cooled (DSC) power module structures enable high power density for motor
drive inverters ideal for electric vehicles (EVs). This work presents a DSC power module …

Combined experimental-FEM investigation of electrical ruggedness in double-sided cooled power modules

C Scognamillo, AP Catalano, P Lasserre… - Microelectronics …, 2020 - Elsevier
In this paper, an experimental and numerical study of the electrical ruggedness in double-
sided cooled power modules is presented. In particular, the analysis focuses on the role of …

Influence of selected factors on thermal parameters of the components of forced cooling systems of electronic devices

K Posobkiewicz, K Górecki - Electronics, 2021 - mdpi.com
The paper presents some investigation results on the properties of forced cooling systems
dedicated to electronic devices. Different structures of such systems, including Peltier …

Optimization of thermal vias design in PCB-based power circuits

AP Catalano, R Trani, C Scognamillo… - … and multi-physics …, 2020 - ieeexplore.ieee.org
The relevant cooling action ensured by the thermal vias in PCB-based power circuits allows
extending the operating conditions of the semiconductor devices. However, to properly drain …

A novel integrated 1.2 kV double-sided cooled power module

R Paul, R Alizadeh, H Chen, X Li… - 2023 IEEE Applied …, 2023 - ieeexplore.ieee.org
This work presents a novel and integrated half-bridge silicon carbide double-sided cooled
power module. The unique design features include 45-degree vertical connection blocks to …

A heterogeneously integrated double-sided cooling silicon carbide power module

R Paul, A Faruque, A Hassan… - 2022 20th IEEE …, 2022 - ieeexplore.ieee.org
A novel half-bridge silicon carbide (SiC) double-sided cooling power module with integrated
gate drivers, decoupling capacitors (C dec), temperature sensors, and a current sensor is …