Vapour phase soldering used for quality improvement of semiconductor thermogenerators (TEGs) assembly
B Synkiewicz, A Skwarek, K Witek - Materials science in semiconductor …, 2015 - Elsevier
The processing of harvested waste heat obtained from industrial or domestic installations
directly converted into electrical energy using thermoelectric generators (TEG) is an …
directly converted into electrical energy using thermoelectric generators (TEG) is an …
Production plan scheduling on SMT manufacturing lines
GÁ Farkas, P Martinek - 2017 IEEE 23rd International …, 2017 - ieeexplore.ieee.org
The assembly order of production jobs (batches) is determined by specific scheduling
algorithms for SMT manufacturing lines. While scheduling itself is a complex and rather time …
algorithms for SMT manufacturing lines. While scheduling itself is a complex and rather time …
The effects of Cu and Al on dry sliding wear properties of eutectic Sn-9Zn lead-free solder alloy
The present study investigates the influence of Cu and Al on microstructure and wear
behavior of a eutectic Sn-9Zn solder alloy. The Sn-9Zn–X alloy was produced by adding …
behavior of a eutectic Sn-9Zn solder alloy. The Sn-9Zn–X alloy was produced by adding …
Microstructural transformation and thermo-mechanical improvement of quinary Bi–Sn–In–Ga–Zn solder bumps on a flexible PET substrate
SH Kim, Y Nam, H Lee, S Back, M Park, GJ Jang… - Materials Science and …, 2017 - Elsevier
Abstract Novel Bi–Sn–In–Ga–Zn powders were fabricated using a gas atomization process.
The addition of 5.0 wt% Zn to a Bi–Sn–In–Ga alloy system resulted in the formation of a pure …
The addition of 5.0 wt% Zn to a Bi–Sn–In–Ga alloy system resulted in the formation of a pure …
Automatic characterisation method for statistical evaluation of tin whisker growth
In this paper, an automatic method was developed to characterise whisker growth
quantitatively in SEM images. The key step of the automatic methods in this case is the …
quantitatively in SEM images. The key step of the automatic methods in this case is the …
Investigating the activation energy of intermetallic layer growth in SAC305 and Innolot alloys
In this paper, the activation energy of intermetallic layer growth was investigated for SAC305
(Sn/3Ag/0.5 Cu) and Innolot (Sn/3.8 Ag/0.7 Cu/3Bi/1.5 Sb/0.2 Ni) lead-free solder alloys. A …
(Sn/3Ag/0.5 Cu) and Innolot (Sn/3.8 Ag/0.7 Cu/3Bi/1.5 Sb/0.2 Ni) lead-free solder alloys. A …
Corrosion investigations on lead-free solder alloys in MgCl2 and NaCl solutions
B Medgyes, G Kósa, P Tamási, B Szabó… - 2017 IEEE 23rd …, 2017 - ieeexplore.ieee.org
This study presents the corrosive properties of five various lead-free solder alloys (including
Innolot and SAC305) at room temperature. The measurements were carried out in a 0.38 …
Innolot and SAC305) at room temperature. The measurements were carried out in a 0.38 …
Investigating intermetallic layer growth in Innolot solder alloy
In this paper, the intermetallic layer growth of the Innolot solder alloy (Sn/3.8 Ag/0.7
Cu/3Bi/1.5 Sb/0.2 Ni) has been investigated. A testboard was designed for 0603 size (1.5× …
Cu/3Bi/1.5 Sb/0.2 Ni) has been investigated. A testboard was designed for 0603 size (1.5× …
Investigation of electrical performance of silicon solar cells with transparent counter electrode
K Drabczyk, J Domaradzki, P Panek… - Microelectronics …, 2015 - emerald.com
Purpose–The purpose of this paper was the investigation of transparent conducting oxide
(TCO) applied as an additional part of front metal electrode of crystalline silicon solar cell …
(TCO) applied as an additional part of front metal electrode of crystalline silicon solar cell …
Whisker growth in Tin alloys on glass-epoxy laminate studied by scanning ion microscopy and energy-dispersive X-ray spectroscopy
Tin-rich solders are widely applied in the electronic industry in the majority of modern printed
circuit boards (PCBs). Because the use of lead-tin solders has been banned in the …
circuit boards (PCBs). Because the use of lead-tin solders has been banned in the …