Comparison of fatigue life prediction methods for solder joints under random vibration loading

J Xia, L Yang, Q Liu, Q Peng, LX Cheng, GY Li - Microelectronics Reliability, 2019 - Elsevier
The fatigue life prediction of solder joints under random vibration load is one of the most
important aspect in design of packaging. A fatigue-life estimation in the frequency domain is …

Fatigue Life Based Study of Electronic Package Mounting Locations on Printed Circuit Boards Subjected to Random Vibration Loads

N Muthuram, S Saravanan - Journal of Electronic Testing, 2024 - Springer
Abstract Plastic Ball Grid Array (PBGA) packages (chips) mounted on a Printed Circuit Board
(PCB) assembly are vulnerable and are more likely to fail when they are subjected to …

Evaluation of the use of a rubber buffer layer to protect embedded SIP devices from high mechanical forces

A Alsakarneh, L Moore, J Barrett - 2011 IEEE 61st Electronic …, 2011 - ieeexplore.ieee.org
Smart objects-objects that can sense and communicate-are the underpinning components of
smart environments and the emerging Internet of Things. Smart objects demand the …

Personalized Anti-Vibration Protection for Telematics Devices in Urban Freight Transport Vehicles

J Wojnowski, J Chmiel - Energies, 2021 - mdpi.com
Vibrations are a major cause of human health disorders, circuit boards and machinery
damage. Vibration dampers are considered to be the best option to counter these issues …

The Development of Digital Image Correlation Method for Electronic Packaging Reliability Assessment

Y Niu - 2017 - search.proquest.com
Abstract In 1964, Gordon Moore summarized the tendency that described the growth of
electronic packages' capacity and integration. Ever since its statement, the Moore's Law has …

[PDF][PDF] Personalized Anti-Vibration Protection for Telematics Devices in Urban Freight Transport Vehicles. Energies 2021, 14, 4193

J Wojnowski, J Chmiel - 2021 - academia.edu
Vibrations are a major cause of human health disorders, circuit boards and machinery
damage. Vibration dampers are considered to be the best option to counter these issues …

[引用][C] Using Analytical Hierarchy Process and TOPSIS Approaches in Designing a Finite Element Analysis Automation Program

M Wen, N Nezamoddini - International Journal of Computer and Information …, 2021