Recent advances in light sources on silicon
Realizing efficient on-chip light sources has long been the “holy-grail” for Si-photonics
research. Several important breakthroughs were made in this field in the past few years. In …
research. Several important breakthroughs were made in this field in the past few years. In …
Transfer print techniques for heterogeneous integration of photonic components
The essential functionality of photonic and electronic devices is contained in thin surface
layers leaving the substrate often to play primarily a mechanical role. Layer transfer of …
layers leaving the substrate often to play primarily a mechanical role. Layer transfer of …
Heterogeneously integrated InP\/silicon photonics: fabricating fully functional transceivers
R Jones, P Doussiere, JB Driscoll, W Lin… - IEEE …, 2019 - ieeexplore.ieee.org
Silicon (Si) photonics research and development started more than 30 years ago and has
intensified in the last 15 years as levels of device functionality, photonic integration, and …
intensified in the last 15 years as levels of device functionality, photonic integration, and …
Hybrid silicon photonic integrated circuit technology
In this paper, we review the current status of the hybrid silicon photonic integration platform
with emphasis on its prospects for increased integration complexity. The hybrid silicon …
with emphasis on its prospects for increased integration complexity. The hybrid silicon …
Two-dimensional free-space beam steering with an optical phased array on silicon-on-insulator
Two-dimensional free-space beam steering with an optical phased array on silicon-on-insulator
clickable element to expand a topic LOGIN OR CREATE ACCOUNT PRISM SUBMISSION …
clickable element to expand a topic LOGIN OR CREATE ACCOUNT PRISM SUBMISSION …
Hybrid III--V on Silicon Lasers for Photonic Integrated Circuits on Silicon
GH Duan, C Jany, A Le Liepvre… - IEEE Journal of …, 2014 - ieeexplore.ieee.org
This paper summarizes recent advances of integrated hybrid InP/SOI lasers and transmitters
based on wafer bonding. At first the integration process of III-V materials on silicon is …
based on wafer bonding. At first the integration process of III-V materials on silicon is …
High-output-power, single-wavelength silicon hybrid laser using precise flip-chip bonding technology
An Si/III–V hybrid laser oscillating at a single wavelength was developed for use in a large-
scale Si optical I/O chip. The laser had an InP-based reflective semiconductor optical …
scale Si optical I/O chip. The laser had an InP-based reflective semiconductor optical …
1.6 Tbps silicon photonics integrated circuit for co-packaged optical-IO switch applications
Abstract We demonstrate 1.6 Tbps Silicon Photonic Integrated Circuit (SiPIC) meeting co-
packaged optics requirements for network switch applications. The SiPIC has sixteen …
packaged optics requirements for network switch applications. The SiPIC has sixteen …
Co-packaged optics (CPO): status, challenges, and solutions
Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter
traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three …
traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three …
InP membrane integrated photonics research
Y Jiao, N Nishiyama, J Van Der Tol… - Semiconductor …, 2020 - iopscience.iop.org
Recently a novel photonic integration technology, based on a thin InP-based membrane, is
emerging. This technology offers monolithic integration of active and passive functions in a …
emerging. This technology offers monolithic integration of active and passive functions in a …