The efficacy of light-emitting diode cooling is anomalously augmented by deploying
nucleate boiling on graphene-nanoplatelets coated surface at sub-atmospheric pressures …

An integrated heat sink with vapor chamber (IHSVC) is developed in this study for the
thermal management of high-power light-emitting diodes (LEDs). The wick, as a key …

In current paper, a finned micro-channel is designed for the cooling application in Light
Emitting Diode (LED), numerically using Galerkin weighted residual Finite Element Method …

In this study, a new heat dissipation device with a composite heat sink of a loop heat pipe
(LHP) system was evaluated for efficient cooling of electronic components. To improve the …

Thermal issues limit the application and development of electronic technique. In this work,
temperature-sensitive poly (N-isopropylacrylamide)(PNIPA) hydrogel is used to dissipate …

In order to better solve the thermal management of high-power LED and facilitate its
miniaturization, an active-passive combined heat dissipation method based on a dual …

Multi-functional porous coatings are promising candidates to improve overall heat transfer
performances of heat sinks that are essential for thermal management of various electronic …

Various types of nanoporous anodic aluminum oxide layers and their sealings were studied
to enhance the thermal emissivity and hence improve the heat dissipation of aluminum alloy …

We exploit the two-phase heat transfer enhancement using plasma-activated water for
application in LED cooling. Within the steady-state LED temperature 80° C≤ T LED≤ 110° …

This paper's goal is to find the impact of incorporation of Phase Change Material (PCM) in
the heat sink for improving the cooling performance of circular Light Edding Diode (LED). A …