[HTML][HTML] Tensile properties dependency on crystal size and direction of single crystal Ag3Sn intermetallic compound: a molecular dynamics study
The necessities of lead-free solder alloys have been expanded by the advent of eco-friendly
technologies of microelectronic packaging industry. Mostly lead-free solder alloys are SAC …
technologies of microelectronic packaging industry. Mostly lead-free solder alloys are SAC …
[HTML][HTML] Dependence of mechanical and thermal deformation behaviors on crystal size and direction of Cu3Sn intermetallic: A molecular dynamics study
The implementation of environment friendly technologies in microelectronic packaging
industry has widened the essentialities of lead-free solder alloys. The Cu 3 Sn intermetallic …
industry has widened the essentialities of lead-free solder alloys. The Cu 3 Sn intermetallic …
Low-Temperature High Strain Rate Constitutive Behavior of Doped and Undoped SnAgCu Solder Alloys after Prolonged Storage at High Temperature
Exposure to extreme-low environmental temperatures in conjunction with high strain-rates
may be encountered by electronics in several harsh-environment applications. Examples …
may be encountered by electronics in several harsh-environment applications. Examples …
Evolution of Anand parameters with elevated temperature aging for SAC leadfree alloys
Electronic equipment in automotive, agricultural and avionics applications may be subjected
to temperatures in the range of− 55 to 200° C during storage, operation and handling in …
to temperatures in the range of− 55 to 200° C during storage, operation and handling in …
Optimal performance and cost-effective design of BGA solder joints using a deterministic design optimization (DDO) under real operating conditions
Users of electronic devices expect efficiency, affordability, and long service life. From this
perspective, the optimization of their performance while reducing costs is paramount. The …
perspective, the optimization of their performance while reducing costs is paramount. The …
Evolution of Anand Parameters for SAC-Q Solder Alloy after Prolonged Storage up to 1-Year at High Strain Rate at Very High Operating Temperature
Solder joints in electronics installed in downhole, automotive and avionics applications may
be exposed to high temperatures (> 150° C) and high strain rates (1-100 per sec) during …
be exposed to high temperatures (> 150° C) and high strain rates (1-100 per sec) during …
High Strain Rate Mechanical Properties of SAC-Q Between-65° C and+ 200° C After Exposure to Isothermal Aging
In many industries, such as automotive, oil and gas, aerospace, medical technologies,
electronic parts can often be exposed to high strain loads during shocks, vibrations and drop …
electronic parts can often be exposed to high strain loads during shocks, vibrations and drop …
Evolution of Anand parameters for thermally aged Sn-Ag-Cu lead-free alloys at low operating temperature
In extreme environmental applications, such as aerospace and automotive, electronics may
endure high or low operating temperatures during service, handling, and storage. An …
endure high or low operating temperatures during service, handling, and storage. An …
Effect of Prolonged Storage on High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder at High Operating Temperature
Electronic devices installed in automotive and downhole drilling applications may be
exposed to high temperature and high strain rates during storage, operation and handling …
exposed to high temperature and high strain rates during storage, operation and handling …
Board level reliability study of next generation large die wafer level chip scale package structures
T Henttonen, P Mescher, D Scott, H Park… - 2018 International …, 2018 - ieeexplore.ieee.org
Wafer Level Chip Scale Package (WLCSP) technologies are being used more often in
electronic components due to their smaller size and lower cost, and are being applied to …
electronic components due to their smaller size and lower cost, and are being applied to …