Si-based group III-V material enables a multitude of applications and functionalities of the
novel optoelectronic integration chips (OEICs) owing to their excellent optoelectronic …

Monolithic integration of III-V semiconductor devices on Silicon (Si) has long been of great
interest in photonic integrated circuits (PICs), as well as traditional integrated circuits (ICs) …

The vast reduction in size and power consumption of CMOS circuitry has led to a large
research effort based around the vision of wireless sensor networks. The proposed networks …

This paper is a review of the remarkable progress that has been made during the past few
decades in design, modeling, and fabrication of micromachined resonators. Although micro …

The vast reduction in size and power consumption of CMOS circuitry has led to a large
research effort based around the vision of ubiquitous networks of wireless communication …

This paper provides a detailed overview of developments in transducer materials technology
relating to their current and future applications in micro-scale devices. Recent advances in …

Wafer bonding with intermediate polymer adhesives is an important fabrication technique for
advanced microelectronic and microelectromechanical systems, such as three-dimensional …

Abstract Development of Si photonic integrated circuits (PICs) has been impeded due to lack
of efficient Si-based light-emitting sources. Because of their indirect bandgap, bulk Ge and …

Within the electronics industry, miniaturisation of silicon components and enhanced
performance has led to high power electronic devices with high packing densities. This has …

Microelectromechanical systems (MEMS) refer to a collection of micro-sensors and
actuators, which can react to environmental change under micro-circuit control. The …