The magnitudes of input power and scan speed of laser heat source can affect the
morphology and size of interfacial Cu 6 Sn 5 intermetallic compound (IMC) formed or grown …

In order to investigate the complicated transient thermal phenomena in laser
micromachining, it is essential to accurately measure time-resolved temperatures of …

Advancement in laser technology and material engineering have progressively increased
the output power and beam quality of solid-state lasers and reduced the price per kilowatt to …

Melt expulsion and surface vaporization are important material removal mechanisms of
pulsed laser drilling of materials. Drilling rate and quality of laser drilled holes depend on the …

In this paper, a generic thermal/mechanical interaction model was developed to predict the
penetration rate and mechanical damage around perforation tunnels that resulted from the …

Determination of hole taper and extent of heat affected zone is a challenging task for
manufacturing engineers from the quality and accuracy point of view of the laser-drilled hole …

This study aims to investigate the simulation of laser drilling processes on Inconel X-750 and
Ti-5Al-2.5 Sn sheets. To this end, COMSOL Multiphysics 5.2 software was employed to carry …

The laser microdrilling of via holes in Si semiconductor wafers was studied using 1 ms
pulses from an Yb fibre laser with 1070 nm wavelength. Optical microscopy and cross …

2.8. 1. Lézeres felületkezelések általános jellemzői 33 2.8. 2. A lézernyaláb jellemzése 33
2.8. 3. A kezelendő felület jellemzése 37 2.8. 4. A lézeres felületkezelések osztályozása 37 …

Abstract [$ CO_2 $] laser ablation rates for bulk 4H-SiC substrates and GaN/AIN/SiC
templates in the range 229-870${\mu} m. min^{-1} $ were obtained for pulse energies of 7.5 …