Sn-based lead-free solder has been widely applied in areas like electronic packaging due to
its excellent solderability. The composite solders can be obtained by mixing additional …

Thermomechanical stress caused by the coefficient of thermal expansion (CTE) mismatch
leads to the formation of cracks, delamination, and warpage in the sintered nano-silver (S …

The soldering process involves the ability of a melted solder to spread and adhere on a
substrate to form a metallic bond driven by the physical and chemical properties of the …