(57) ABSTRACT AIC package for a wireless device includes an antenna that is attached to
the chip. The electrically conductive elements of the antenna are spaced away from the …

The system-on-a-package (SOP) concept is considered as the solution of future
communication modules, where more functionality, better performance, low cost, and more …

The present invention relates to an integrated circuit package comprising at least one
substrate, each substrate including at least one layer, at least one semiconductor die, at …

A system comprising at least one antenna and a circuit, wherein the circuit is at least in part
not a semiconductor chip or a die. The at least one antenna and the circuit are arranged on …

A low-cost broadband interconnect, composed of bondwires and transmission lines, is
proposed for heterogeneous system integration. By designing the length and the …

An interconnecting technology using a Au-Au thermocompressive bond has been
successfully developed for microelectromechanical system (MEMS) heterogeneous chip …

Several new components and design concepts are developed for integration in millimeter-
wave front-ends. This includes antennas and novel filter configurations appropriate for a …

Nov. 3, 2006, now Pat. No. 7,791,539, which is a A SV Stem comprising at least one antenna
and a circuit continuation-in-part of application No. 1 1/488,107, ys imprising filed on Jul. 17 …

The present invention relates to an integrated circuit package comprising at least one
substrate, each substrate including at least one layer, at least one semiconductor die, at …

[eng] The context of this thesis is the design of CMOS low power RFIC's suitable for direct
conversion architectures. Our starting point is the analysis of the characteristics of the …