[HTML][HTML] A review on design alteration in microchannel heat sink for augmented thermohydraulic performance
The present trend of miniaturization in various electronic devices has caused higher heat
generation per unit area. Dissipation of highly concentrated heat from these devices is …
generation per unit area. Dissipation of highly concentrated heat from these devices is …
Numerical study on the anisotropy in thermo-fluid behavior of triply periodic minimal surfaces (TPMS)
Porous structures are frequently utilized as thermal conductivity enhancers in the realm of
heat transfer enhancement. Triply Periodic Minimal Surface (TPMS) has gained significant …
heat transfer enhancement. Triply Periodic Minimal Surface (TPMS) has gained significant …
A novel pin finned structure-embedded microchannel heat sink: CFD-data driven MLP, MLR, and XGBR machine learning models for thermal and fluid flow prediction
Microscale mechanical systems benefit from microchannel heat sinks' heat transfer
efficiency. This study uses six new pin fin shapes embedded in microchannel to improve …
efficiency. This study uses six new pin fin shapes embedded in microchannel to improve …
Constructal design of a hybrid heat sink with rectangular microchannel and porous fin in a 3D electronic device with artificial neural-network, NSGA-II and different …
B Wu, H Feng, L Chen, Y Ge, X Liu - International Communications in Heat …, 2024 - Elsevier
Constructal theory is used to build a hybrid heat-sink model with rectangular microchannel
and porous fin in a 3D electronic device. Firstly, constructal design is conducted with …
and porous fin in a 3D electronic device. Firstly, constructal design is conducted with …
[HTML][HTML] A gyroid TPMS heat sink for electronic cooling
The trend toward thinner and lighter electronic devices necessitates developing advanced
thermal management solutions to address modern microprocessors' escalating heat …
thermal management solutions to address modern microprocessors' escalating heat …
On the reticulate pattern and heat transfer performance of the topologically optimized microchannel heat sink
With the increasing integration of electronic devices, the rapid heat dissipation has become
a key challenge for performance improvement. In this work, a 2D topology optimization for …
a key challenge for performance improvement. In this work, a 2D topology optimization for …
Constructal design of a rectangular parallel phase change microchannel in a three-dimensional electronic device
JW Zhang, HJ Feng, LG Chen, YL Ge - Science China Technological …, 2024 - Springer
Based on constructal theory, a rectangular parallel phase change microchannel model in a
three-dimensional electronic device (TDED) is established with R134a as the cooling fluid …
three-dimensional electronic device (TDED) is established with R134a as the cooling fluid …
Characterization of MEMS heat sinks having straight microchannels integrating square pin-fins for liquid cooling of microelectronic chips
A Alkhazaleh, F Alnaimat, B Mathew - Thermal Science and Engineering …, 2023 - Elsevier
This work presents a liquid based MEMS (microelectromechanical systems) heat sink
having straight microchannel integrating square pin-fins for cooling of microelectronic chips …
having straight microchannel integrating square pin-fins for cooling of microelectronic chips …
A novel microchannel-twisted pinfin hybrid heat sink for hotspot mitigation
Thermal hotspots cause excessive localized temperature rise, leading to significant
temperature gradients across the microprocessor, which is the primary reason for its …
temperature gradients across the microprocessor, which is the primary reason for its …
[HTML][HTML] Numerical analysis of mono and hybrid nanofluids-cooled micro finned heat sink for electronics cooling-(Part-I)
This study explores the thermohydraulic performance of metallic-oxide and carbon-additives-
based mono and hybrid nanofluids-cooled micro pin-fin heat sink by adopting the …
based mono and hybrid nanofluids-cooled micro pin-fin heat sink by adopting the …