[HTML][HTML] A road map for reliable power electronics for more electric aircraft

AJ Wileman, S Aslam, S Perinpanayagam - Progress in Aerospace …, 2021 - Elsevier
The gradual evolution from hydro-pneumatic to electrical disposition of power in aircraft has
placed stringent requirements on the reliability of power electronic components in current …

[PDF][PDF] IGBT 模块寿命评估研究综述

张军, 张犁, 成瑜 - TRANSACTIONS OF CHINA …, 2021 - dgjsxb.ces-transaction.com
摘要绝缘栅双极型晶体管(IGBT) 是电力电子系统实现电能变换与控制的核心组件之一. 然而,
工业界反馈的数据表明, 应用于高可靠性场合的IGBT 模块可靠性并不高, 其热疲劳失效将会导致 …

Failure and reliability analysis of a SiC power module based on stress comparison to a Si device

B Hu, JO Gonzalez, L Ran, H Ren… - … on device and …, 2017 - ieeexplore.ieee.org
The superior electro-thermal properties of silicon carbide (SiC) power devices permit higher
temperature of operation and enable higher power density compared with silicon devices …

Novel detection approach for thermal defects: Study on its feasibility and application to vehicle cables

K Liu, Z Yang, W Wei, B Gao, D Xin, C Sun… - High …, 2023 - Wiley Online Library
It is important to accurately assess the thermal defect state of equipment to ensure its safe
operation. A novel thermal defect detection method called the square even‐order derivative …

Interleaved planar packaging method of multichip SiC power module for thermal and electrical performance improvement

F Yang, L Jia, L Wang, F Zhang, B Wang… - … on Power Electronics, 2021 - ieeexplore.ieee.org
Double-sided cooling based on planar packaging method features better thermal
performance than traditional single-sided cooling based on wire bonds. However, this …

Lifting-off of Al bonding wires in IGBT modules under power cycling: failure mechanism and lifetime model

Y Huang, Y Jia, Y Luo, F Xiao… - IEEE Journal of Emerging …, 2019 - ieeexplore.ieee.org
Lifting-off of Al bonding wires is one common failure mode of insulated-gate bipolar
transistor (IGBT) modules during long-time operation. In the present work, the failure …

Forced air cooled heat sink with uniformly distributed temperature of power electronic modules

C Bünnagel, S Monir, A Sharp, A Anuchin… - Applied Thermal …, 2021 - Elsevier
The paper discusses an approach to the design of the forced air-cooling heat sink for power
electronic application to uniformly distribute the temperature of the semiconductor modules …

On image transformation for partial discharge source identification in vehicle cable terminals of high‐speed trains

K Liu, S Jiao, G Nie, H Ma, B Gao, C Sun, D Xin… - High …, 2024 - Wiley Online Library
Partial discharge (PD) detection of cable terminals is crucial for the safe operation of the
traction power system in trains. However, similar PD signals in complex train‐operating …

PSpice-COMSOL-based 3-D electrothermal–mechanical modeling of IGBT power module

Y Jia, F Xiao, Y Duan, Y Luo, B Liu… - IEEE Journal of …, 2019 - ieeexplore.ieee.org
The behavior of the insulated gate bipolar transistor (IGBT) module results in the electric
field, temperature field, and stress field, and there are strong coupling effects among its …

Iterative machine learning-aided framework bridges between fatigue and creep damages in solder interconnections

V Samavatian, M Fotuhi-Firuzabad… - IEEE Transactions …, 2021 - ieeexplore.ieee.org
Costly and time-consuming approaches for solder joint lifetime estimation in electronic
systems along with the limited availability and incoherency of data challenge the reliability …