Recent growth of the insulated gate bipolar transistor (IGBT) module market has been driven
largely by the increasing demand for an efficient way to control and distribute power in the …

As an increasing attention towards sustainable development of energy and environment, the
power electronics (PEs) are gaining more and more attraction on various energy systems …

Nowadays, a major concern of Sn–Cu based solder alloy today is focused on continuously
improving the comprehensive properties of the solder joints formed between the solders and …

Rapid reliability analysis of the solder joints in the electronic devices identifies as an
appeared gap in the design stage. This paper demonstrates the feasibility of employing the …

Remaining useful life (RUL) prediction is crucial for the safety and reliability of engineering
systems with stringent requirements, like high-speed trains. Previous studies on fixed or …

This paper presents a numerical investigation of the probabilistic approach in estimating the
reliability of wire bonding, and develops a reliability-based design optimization Methodology …

We propose a liquid cooling system incorporating a porous medium combined to the
multiscale flow manifold. Specifically, this work compares two types of porous media by …

Sn–Cu eutectic modified by minor In, Cr and Ni additions are one of the major alternatives to
lead-free solders. The results show that nanostructured solders produced by rapid …

This paper reports on the crack behavior and microstructure evolution of lead free solder
joints during thermal and isothermal fatigue testing. Daisy chained Ball Grid Array (BGA) …

State estimation problem is considered for a kind of wireless network control system with
stochastic uncertainty and time delay. A sliding mode observer is designed for the system …