Deformation behaviour of interconnect encapsulated on functionally graded stretchable substrates

Experimental and numerical investigation on reliability of encapsulated sine wave interconnect for stretchable substrates

D Patidar, A Bhasin, VK Pal - Microelectronics Reliability, 2024 - Elsevier
This article focuses on enhancing the reliability of stretchable electronic interconnects
designed to withstand challenging mechanical conditions such as stretching, bending, and …
相关文章 所有 2 个版本