BACKGROUND Integrated circuits have experienced continuous rapid growth due to
constant improvements in the integration den sity of various electronic components (ie …

BACKGROUND Semiconductor devices are used in a variety of electronic applications, such
as personal computers, cellphones, digital cameras, and other electronic equipment, as …

A system and method for stacking semiconductor devices in three dimensions is provided. In
an embodiment two or more semiconductor dies are attached to a carrier and encapsulated …

A method of vertically stacking wafers is provided to form three-dimensional (3D) wafer
stack. Such method comprising: selectively depositing a plurality of metallic lines on …

Embodiments of forming a semiconductor device structure are provided. The semiconductor
device structure includes a first semiconductor wafer and a second semiconductor wafer …

BACKGROUND Generally, through-silicon vias (TSVs) have been used to form electrical
connections within System-in-Package (SiP) architectures to connect multiple …

BACKGROUND The present disclosure relates generally to semiconductor manufacturing
and, more particularly, to a method for fabri cating a stacked semiconductor device. Vias …

A device includes an interposer, which includes a substrate; and at least one dielectric layer
over the substrate. A plurality of through-substrate vias (TSVs) penetrate through the …

An apparatus, method, and system for electronic device packaging having stacked dice are
disclosed herein. A first die has a through silicon via formed therethrough. A second die is …

A method of forming a multi-layer semiconductor structure includes attaching a handle-
member to a top surface of a first structure using a first interface. At least one region of a …