High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package
Epoxy-based molding compounds (EMC) are widely used to encapsulate automotive
electronics. Under high temperature operation, EMC is oxidized and undergoes degradation …
electronics. Under high temperature operation, EMC is oxidized and undergoes degradation …
Thermo-curable and photo-patternable polysiloxanes and polycarbosiloxanes by a facile Piers–Rubinsztajn polycondensation and post-modification
W Fan, N Hong, Q Sun, M Li, W Fu - Polymer Chemistry, 2022 - pubs.rsc.org
With the rapid development of integrated circuit (IC) chips towards nanometric
miniaturization, advanced integration and high performance, interlayer dielectric (ILD) …
miniaturization, advanced integration and high performance, interlayer dielectric (ILD) …
A production-worthy fan-out solution-ase focos chip last
JK Fang, ML Huang, HJ Tu, WL Lu… - 2020 IEEE 70th …, 2020 - ieeexplore.ieee.org
The 5 th Generation (5G) wireless systems popularity will push the package development
into a high performance and heterogeneous integration form. For high I/O density and high …
into a high performance and heterogeneous integration form. For high I/O density and high …
Accuracy of CMOS-based piezoresistive stress sensor for engineering applications of thermal loading condition: Theoretical review and experimental validation
A Prisacaru, A Palczynska, P Gromala… - IEEE Sensors …, 2019 - ieeexplore.ieee.org
Measurement uncertainties of a CMOS-based piezoresistive stress sensor are studied for
low cycle thermal loading applications. After the fundamentals of the sensor are reviewed …
low cycle thermal loading applications. After the fundamentals of the sensor are reviewed …
A full-field warpage characterization measurement method coupled with infrared information
The thermomechanical properties of microelectronic packages can serve as important
indicators of reliability. Indeed, it is of great interest in dynamic warpage measurement of …
indicators of reliability. Indeed, it is of great interest in dynamic warpage measurement of …
Towards virtual twin for electronic packages in automotive applications
A Prisacaru, EO Guerrero, B Chimmineni… - Microelectronics …, 2021 - Elsevier
The piezoresistive silicon based stress sensor has the potential to be part of the Digital Twin
implementation in automotive electronics. One solution to enforce reliability in digital twins is …
implementation in automotive electronics. One solution to enforce reliability in digital twins is …
Application of multi-quality parameter design in the optimization of underfilling process–a case study of a vehicle electronic module
Purpose This paper aims to discuss the key factors affecting the quality characteristics, such
as the number of solder balls, the spread distance of residual underfill and the completion …
as the number of solder balls, the spread distance of residual underfill and the completion …
Study of thermal aging behavior of epoxy molding compound for applications in harsh environments
A Inamdar, A Prisacaru, M Fleischman… - 2019 IEEE 69th …, 2019 - ieeexplore.ieee.org
In the automotive industry, epoxy-based molding compounds (EMCs) are often used to
protect not only single IC packages but also entire electronic control units (ECUs). The EMC …
protect not only single IC packages but also entire electronic control units (ECUs). The EMC …
Measurement of anisotropic coefficients of thermal expansion of SAC305 solder using surface strains of single grain with arbitrary orientation
The anisotropic coefficient of thermal expansions (CTEs) of SAC305 grain are measured
using a full-field in-plane displacement measurement technique. Theoretical relationships …
using a full-field in-plane displacement measurement technique. Theoretical relationships …
EMC oxidation under high-temperature aging
Epoxy molding compound (EMC) is widely used for encapsulating automotive electronics.
Among all of the components of an electronic package, EMC is most exposed to the …
Among all of the components of an electronic package, EMC is most exposed to the …