As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder,
solder powder, and a fluxing resin system, has been quantitatively characterized. The …

Epoxy resins find extensive utility across diverse applications owing to their exceptional
adhesion capabilities and robust mechanical and thermal characteristics. However, the …

For the fine‐pitch application of flip‐chip bonding with semiconductor packaging, fluxing and
hybrid underfills were developed. A micro‐encapsulated catalyst was adopted to control the …

The transfer process of moving individual micro-LED chips to a display substrate has been
regarded as the biggest technical obstacle for the commercialization of displays based on …

TSV chips were designed and fabricated to investigate the effects of the types of the stacking
process on the manufacturability. Two processes were compared: thermocompression and …

Thermoset resins have been extensively utilized as an adhesive for electronic devices. In
particular, semiconductor packaging materials between chips/substrates require electrical …

An epoxy-based solder paste (ESP) is a promising alternative to conventional solder pastes
to improve the reliability of fine-pitch electrical joining because the epoxy encapsulates the …

Flexible displays and electronics are emerging technology. A PET substrate is one the
strong candidate substrate materials for the applications, however, its low thermal stability …

A novel bumping material, which is composed of a resin and Sn3Ag0. 5Cu (SAC305) solder
power, has been developed for the maskless solder‐on‐pad technology of the fine‐pitch flip …

A cost‐effective and simple solder on pad (SoP) process is proposed for a fine‐pitch
microbump interconnection. A novel solder bump maker (SBM) material is applied to form a …