Package Design Through Reliable Predictive Modeling and Its Validation

P Yin, S Park, B Jacob, L Yin… - 2022 IEEE 72nd …, 2022 - ieeexplore.ieee.org
The outer packing of electronic products plays a significant role in keeping inner electronics'
functionality. The different designs and materials of outer packing would decrease or isolate …

Enhanced Foam Package Design for Drop/Impact Using Accurate Predictive Simulation

P Yin, S Park, B Jacob, A Gowda - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
The interconnections and chips of the internal components of electronic devices need to be
protected to prevent damage during shipping, handling, and daily use. This article studied …

Ionic Sensor Package Design for the Survivability in a Drop/Impact During Deployment

P Yin, J Ha, J Yang, Y Lai, S Park… - 2023 IEEE 73rd …, 2023 - ieeexplore.ieee.org
By utilizing different outer package designs and materials, it is possible to reduce or isolate
impact energy, which can prevent damage or destruction of interconnections and chips that …