This paper reviews recent progress and future directions of signal integrity design for high-
speed digital circuits, focusing on four areas: signal propagation on transmission lines …

Mitigating power distribution network (PDN) noise is one of the main efforts for power
integrity (PI) design in high-speed or mixed-signal circuits. Possible solutions, which are …

The impedance of a power-distribution network (PDN) in three-dimensionally stacked chips
with multiple through-silicon-via (TSV) connections (a 3D TSV IC) was modeled and …

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit
Boards and Packaging presents the electromagnetic modelling and design of three major …

In this paper, a new modeling method for estimating the impedance properties in a chip-
package hierarchical power distribution network (PDN) is proposed. The key ideas of the …

A systematic approach for inductance extraction for via arrays between two parallel planes is
presented. Both self and mutual inductance values are obtained based on a cavity model …

Magnetic near-field probes (NFP) represent a suitable tool to measure the magnetic field
level from a small electromagnetic interference (EMI) source. This kind of antenna is useful …

A methodology for modeling the power delivery network from the voltage regulator module
to the pins of a high pin count integrated circuit on a printed circuit board (PCB) is presented …

In this paper, the effects of electromagnetic interference (EMI) coupled to a radio-frequency
(RF) communication channel by resonant mechanisms are investigated and described in the …

The transfer functions relating supply voltage fluctuations to jitter are analytically derived in
closed form expressions for a single-ended buffer. The analytic transfer functions are …