A 21-to-41-GHz high-gain low noise amplifier with triple-coupled technique for multiband wireless applications
Y Yu, J Zhu, Z Zong, P Tang, H Liu… - … on Circuits and …, 2020 - ieeexplore.ieee.org
This brief presents a wideband millimeter-wave (mm-Wave) low noise amplifier (LNA) with a
triple-coupled technique for multiband wireless applications. To enlarge the gain and reduce …
triple-coupled technique for multiband wireless applications. To enlarge the gain and reduce …
A 16-Gb/s low-power inductorless wideband gain-boosted baseband amplifier with skewed differential topology for wireless network-on-chip
This paper presents an inductorless wideband gain-boosted baseband (BB) amplifier
suitable for wireless network-on-chip (WiNoC) architectures. Current reuse active feedback …
suitable for wireless network-on-chip (WiNoC) architectures. Current reuse active feedback …
High-performance and small-form factor near-field inductive coupling for 3-D NoC
Wireless interconnects using near-field inductive coupling (NFIC) enables contactless
vertical communications necessary for the design of energy efficient and robust 3-D …
vertical communications necessary for the design of energy efficient and robust 3-D …
Energy and area efficient near field inductive coupling: A case study on 3D NoC
Near Field Inductive Coupling (NFIC) enables design of energy efficient and robust three-
dimensional (3D) manycore systems. The associated design challenges and the trade-offs …
dimensional (3D) manycore systems. The associated design challenges and the trade-offs …
A Triple-Band, High DC-to-RF Efficiency, Multicore VCO With a Dual-Path Inductor and Mode-Switching Capacitor
MA Hoque, D Heo - IEEE Transactions on Microwave Theory …, 2024 - ieeexplore.ieee.org
This article introduces an innovative four-port dual-path inductor designed to deliver two
distinct inductance values to the resonator of a voltage-controlled oscillator (VCO). The …
distinct inductance values to the resonator of a voltage-controlled oscillator (VCO). The …
A hybrid 3D interconnect with 2X bandwidth density employing orthogonal simultaneous bidirectional signaling for 3D NoC
For the first time, this work presents a wireless-wireline hybrid 3D interconnect that employs
orthogonal simultaneous bidirectional signaling for 3D Network-on-chip to achieve 2x …
orthogonal simultaneous bidirectional signaling for 3D Network-on-chip to achieve 2x …
Spanning the Spectrum: High-Performance Signal Source Design for the Millimeter-Wave Age
The millimeter-wave (mm-wave) frequency range is consumer wireless technology's next
frontier. Next-generation cellular technologies demand ever-increasing data rates, reduced …
frontier. Next-generation cellular technologies demand ever-increasing data rates, reduced …
A low power active-passive dual Gm-boosted W-band oscillator for wireless networ-on-chip applications
A low power active-passive dual Gm-boosted W-band oscillator is proposed leveraging a
passive and active dual boosting technique to reduce power consumption and phase noise …
passive and active dual boosting technique to reduce power consumption and phase noise …
An echo-canceller-iess NFIC-TSV hybrid 3D interconnect for simultaneous bidirectional vertical communication
This paper presents an echo-canceller-less wireless-wireline hybrid 3D interconnect for
simultaneous bidirectional (SBD) vertical communication. This is accomplished by …
simultaneous bidirectional (SBD) vertical communication. This is accomplished by …
Energy-efficient and robust 3D NoCs with contactless vertical links
3D integration, a breakthrough technology to achieve" More Moore and More Than Moore,"
provides numerous benefits such as better performance, lower power consumption, and …
provides numerous benefits such as better performance, lower power consumption, and …