In the realm of military and defence applications, exposure to radiation significantly
challenges the performance and reliability of solder alloys and joints in electronic systems …

The failure of one solder joint out of the hundreds of joints in a system compromises the
reliability of the electronics assembly. Thermal cycling is a result of both creep–fatigue …

Failure due to thermal cycling is common at the solder joint level of electronic assemblies
due to the mismatch in the coefficient of thermal expansions between the carrier and printed …

abstract Solder joint, crucial component in electronic systems, face significant challenges
when exposed to extreme conditions during applications. The solder joint reliability involving …

In harsh applications, the electronic systems' reliability relies on the mechanical integrity of
hundreds of solder interconnection against various triggers. The reliability is threatened by …

Under realistic service conditions, solder joints experience thermal cycling fatigue due to
long periods of temperature changes. This leads to degradation of mechanical and …