The layout of power modules is one of the key points in power module design, especially for
high power densities, where couplings are increased. In this paper, along with the design …

This paper focuses on a new generation of power modules, trying to optimize the tradeoff
between thermal and electromagnetic interference (EMI) managements. At the same time …

The layout of power multichip modules is one of the key points of a module design,
especially for high power densities, where couplings are enlarged. This paper focuses on …

Due to high-current commutation speed, it has become necessary to minimize stray
inductances to reduce over-voltage. This is a great challenge for the power-converter …

A novel flip-chip flex-circuit packaging platform is described that enables integration of
multiple power dies and control circuitry with an advantageous form factor. A key attribute of …

Power electronics is today the most common way for electrical power conversion. However,
a set of new problems, linked to ElectroMagnetic Compatibility (EMC) arises from the …

In order to reduce power losses and increase system power density, IGBT switching speeds
in industrial motor drives continue to increase. These fast switching speeds, combined with …

This paper investigates the impact of stray elements (inductance, capacitance) on the
switching behavior. Voltage overshoots, ringing, EMC, losses are under concern. Positive …

Due to high current commutation speed, it has become necessary to minimize stray
inductances to reduce over voltage. This is a great challenge for the power converter …

Power electronic applications need high voltage and current ranges which are impossible to
obtain with discrete devices. Parallelization technique is a solution to increase power …