Porous Cu sheets with the pores per inch (ppi) of 110 and 500 were used as additives to
improve the performances of the Sn58Bi (SnBi) solder joint. The effects of porous Cu on the …

To fully characterize Friction Stir Welding several techniques are required, mainly
destructive, as hardness or metallographic testing. However, there is still a need for …

Abstract Effect of silicon content on the microstructure (lamellar and flake), mechanical
(microhardness, ultimate tensile strength) and electrical resistivity properties of Al–Cu–Fe–Si …

The development of lead-free solders has emerged as one of the key issues in the
electronics packaging industries. Sn―Zn―Bi eutectic alloy has been considered as one of …

A wide range of solid-state manufacturing technologies for joining and modification of
material original properties are assuming increasing importance in industrial applications …

The thermodynamic model in conjunction with Butler equation and the geometric models
were used for the surface tension calculation of Cd–Sn–Zn liquid alloys. Good agreement …

The variations of thermal conductivities of solid phases versus temperature for pure Sn, pure
Al and Sn–0.5 wt.% Al, Sn–2.2 wt.% Al, Sn–25wt.% Al, Sn–50wt.% Al, Sn–75wt.% Al binary …

Al–Cu–Ag eutectic alloy was directionally solidified upwards with different growth rates (1.83–
498.25 μm/s) at a constant temperature gradient (8.79 K/mm) and with different temperature …

Pb (100− x)-Sn x solders (x= 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%,
and 95 wt.%) were directionally solidified upward with a constant growth rate (V= 37.4 μ m/s) …

A novel method of fabrication of gadolinia doped bismuth oxide nanoceramic via the sol–gel
technique is reported. Their thermal, structural and morphological properties are described …