Semiconductor and laser single crystals are usually brittle and hard, which need to be
ground to have satisfactory surface integrity and dimensional precision prior to their …

Atomistic-based multiscale and molecular dynamics modeling are powerful tools to simulate
the localized strain problems, offering tremendous opportunities to bridge the knowledge …

Single crystal Si subsurface damage and phase transformation caused by laser-assisted
nanometric cutting were investigated in this paper through the ultraprecision cutting …

Achieving nanometric surface on single-crystal silicon is important for semiconductor and
optoelectronics industries. In recent years, thermal assisted machining (hot machining) …

The monocrystalline Cu material mechanical properties at the micro and nano scale show
complex anisotropy and size effects. However, the anisotropy of scratch hardness and …

Ultrasonic vibration cutting (UVC) is a promising technology that can promote the processing
of hard-brittle materials in ductile mode. The feature of intermittent cutting in UVC is …

Nanoindentation and scratch experiments probe the hardness by leaving a permanent
imprint on the material's surface. The scratch hardness, however, is less used due to its …

The ultra-precision grinding technology based on a workpiece self-rotational principle is
extensively used for silicon wafer thinning in the chip post-processing. Nevertheless, owing …

In advanced semiconductor packaging, silicon wafers are typically thinned to tens of microns
in thickness using ultra-precision grinding techniques, and the cutting speed greatly …

In nanometric cutting, the deformation mechanism is significantly affected by the cutting
temperature. In this paper, molecular dynamics simulation was conducted to investigate the …